Hardware: The engine of innovation
We’re pioneering purpose-built hardware with open software and flexible model consumption to democratize frontier-scale compute.
Custom-engineering TPUs for the future of AI
Distinct, purpose-built architectures designed to power our custom-built supercomputers—driving everything from cutting-edge model training and agent development to massive inference workloads.
TPU 8t
Built for large-scale pre-training and embedding-heavy workloads at a scale of 9,600 chips in a single superpod. It delivers the high-density compute required for frontier models with nearly 3x the compute performance per pod over the previous generation.
TPU 8i
Optimized for post-training and inference. It delivers 80% better performance-per-dollar over previous generations for low-latency inference for large MoE models.
Specialized by design
Deep dive inside the architecture of the eighth-generation TPUs and see how our design philosophy has evolved to meet the operational intensities of the agentic AI workloads.
Network-to-software orchestration
The streamlined Virgo scale-out network is tightly integrated with software frameworks like Pathways to scale training clusters to over 1 million chips while automated telemetry routes around optical link failures.
Accelerator-to-host co-design
By embedding Google's custom Arm-based Axion CPU hosts directly into the hardware nodes and utilizing NUMA resource isolation, the system completely removes traditional host-processing bottlenecks.
Direct storage access
The TPUDirect architecture slashes data transit latency by enabling direct memory access between high-performance storage systems and TPU HBM, bypassing the host CPU and standard DRAM entirely to speed up ingestion by 10x.
Hardware-to-developer software abstraction
The introduction of TorchTPU for native PyTorch compatibility, combined with bare-metal compilers like Pallas and Mosaic, allows developers to write low-level kernels directly to custom silicon.
Google split its AI chip. Here’s why it matters for enterprises.
3x compute performance per pod
While scaling up to 9,600 chips and maximizing utilization with TPU 8t.
3x more on-chip SRAM
With 5x reduced on-chip latency and 80% better performance per dollar from TPU 8i.
353% 3-year ROI
And 28% lower IT costs with AI Hypercomputer.
4x network bandwidth-per-vCPU
Over standard C4 instances, with C4N instances.
What makes a TPU a TPU?
A TPU is a custom-engineered supercomputer specialized exclusively for multi-dimensional array math.
Co-designed with Google DeepMind
TPUs are the result of a decade of deep, system-level co-design, where hardware, software, and model research are developed as a single, inseparable system.
Big cores, not thousands of small ones
Unlike traditional GPUs that partition silicon into thousands of Streaming Multiprocessors with complex Single-Instruction Multiple-Thread scheduling, a TPU chip uses massive "TensorCores" (usually 1–2 per chip) plus auxiliary SparseCores. Operating on large data blocks via a few big cores provides a simpler programming model. By eliminating massive thread queues and dynamic branch logic, execution is exceptionally predictable, allowing compilers to schedule computations with zero runtime overhead.
A Systolic Matrix Multiply Unit (MXU), not SIMT Tensor Cores
GPUs rely on warp registers to fetch operands for every math step, while TPU's MXU uses a systolic array where data streams through a 2D grid of processing elements. Inputs flow horizontally and vertically, reusing operands across cycles without writing intermediate results back to registers. Accumulating in full FP32 precision to ensure high numerical range, this structural predictability is why matrix dimension alignment is critical to maximizing execution efficiency.
Compiler-Controlled Memory (VMEM), not caches
Most accelerators rely on hardware L1/L2 caches, causing runtime latency jitter and non-deterministic cache misses. The TPU’s local memory hierarchy is entirely compiler-controlled. Vector Memory is a high-speed scratchpad explicitly staged from High-Bandwidth Memory by an async Direct Memory Access unit under XLA compiler control. This makes data movement static and predictable, allowing offline performance simulators to accurately map execution timelines ahead of time.
Optically Circuit-Switched Torus, not switched fabrics
Standard GPU fabrics use high-power, latency-sensitive electrical switches. TPU pods are wired as 2D/3D torus topologies connected via Google’s Optical Circuit Switches, which use micro-mirrors to route raw light paths. Establishing direct, physical fiber connections at the start of a training job eliminates packet-routing overhead, drastically cuts latency, and lets the compiler dynamically carve massive pods into isolated, fault-tolerant slices on the fly.
Range over precision, and repeatable determinism
We prioritized range over precision to cut memory traffic and boost density with TPUv2’s Brain Float 16 (FP32 range with 7-bit mantissa), then doubled compute throughput by adding 8-bit floating point (E4M3/E5M2) to TPU v5p and v7. TPU 8t/8i introduced native 4-bit floating point (FP4) support directly in the systolic array, delivering up to 4x throughput over BF16. To ensure reliability at low precision, TPUs enforce bitwise determinism, hardware replay, and Functional Built-In Self-Tests against Silent Data Corruption, guaranteeing reproducible runs for large-scale debugging.
Direct-to-chip liquid cooling
While conventional server fleets treat thermal management as a mechanical packaging afterthought, TPU supercomputers integrate thermal dissipation as a foundational architectural constraint. Beginning with TPU v3 in 2018, Google transitioned all frontier training systems to direct-to-chip liquid cooling. Liquid cooling addresses three foundational scaling bottlenecks:
Thermal determinism
Liquid cold plates maintain exceptionally uniform temperatures, preventing localized thermal throttling and runtime latency stragglers during massive training runs and guaranteeing the cycle-level predictability required by compiler schedules.
Physical packaging density
Eliminating bulky air-cooling hardware allows 64 TPU chips to be densely packed into a single standard rack enclosure, shortening high-speed Inter-Chip Interconnect traces so low-power direct-attach copper cables can replace expensive optical transceivers.
Megawatt efficiency and PUE
Pumping heat directly into liquid cooling distribution units allows data centers to run warm-water cooling loops without mechanical chillers, contributing to an industry-leading Power Usage Effectiveness (PUE ~ 1.10) and nearly double the compute density per megawatt compared to forced-air systems.
“The future of AI is about real-time interaction, not just training. We're moving into the ‘age of inference’, and we offer the broadest portfolio of accelerators to power the intelligent experiences of tomorrow.”
Redefining general-purpose compute
Designed to deliver compelling performance, cost, and energy efficiency for everyday workloads.
Axion N4A, our second general-purpose Axion VM, unlocks 2x better price-performance to make it easier to optimize cost.
Axion C4A is designed for specialized workloads that require direct hardware access and Arm®-native compatibility.
Championing customer choice with systems-level innovation
AI Hypercomputer
Choose between TPUs, NVIDIA GPUs, or our custom Axion CPUs based on your needs, with vertically integrated performance-optimized hardware, open software, and flexible consumption models.
NVIDIA GPUs on Google Cloud
Access the versatile power of the latest NVIDIA GPUs with accelerator-optimized solutions to support demanding workloads.
Prediction: Specialization will continue and CPUs will make a comeback
Break through the scaling limits of generic hardware
Get access to the same frontier-scale infrastructure that powers advanced models like Gemini and iconic products like Search and YouTube. Available to developers and enterprises through Google Cloud.